Invention Grant
- Patent Title: Bonding method for conductor of electric wire and electric wire
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Application No.: US16288428Application Date: 2019-02-28
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Publication No.: US10797457B2Publication Date: 2020-10-06
- Inventor: Tomoya Sato , Kazuhide Takahashi , Naoki Ito , Yasunori Nabeta
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@12f52fe4
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R43/02 ; H01R4/02 ; B23K20/10 ; B23K20/22 ; H01R43/28 ; B23K101/32 ; B23K101/38

Abstract:
A bonding method for a conductor of an electric wire includes a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method ultrasonically bonds the plurality of strands of the electric wire to each other using an anvil and a horn. When the strands are ultrasonically bonded to each other by clamping a part of the conductor exposed from the sheath between the anvil and the horn throughout a predetermined length and ultrasonically vibrating the horn, a distance from the anvil or the horn to the sheath of the electric wire is shorter than a length of the strands when the strand vibrates in a primary mode by ultrasonic vibration.
Public/Granted literature
- US20190273354A1 BONDING METHOD FOR CONDUCTOR OF ELECTRIC WIRE AND ELECTRIC WIRE Public/Granted day:2019-09-05
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