Invention Grant
- Patent Title: Acoustic wave device, radio-frequency front end circuit, and communication device
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Application No.: US16529841Application Date: 2019-08-02
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Publication No.: US10797678B2Publication Date: 2020-10-06
- Inventor: Masakazu Mimura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c5ec6d9
- Main IPC: H03H9/145
- IPC: H03H9/145 ; H03H9/25 ; H03H9/02 ; H03F3/21

Abstract:
An acoustic wave device utilizes Love waves and includes a piezoelectric substrate (piezoelectric body), an IDT electrode provided on the piezoelectric substrate, and a first dielectric film that is provided on the piezoelectric substrate and covers the IDT electrode. A center region, first and second edge regions, and first and second gap regions are disposed in this order in the IDT electrode. A mass-adding film is provided inside the first dielectric film in the first edge region and the second edge region. When T1 is the film thickness of the portion of the first dielectric film located between the IDT electrode and the mass-adding film and T2 is the film thickness of the portion of the first dielectric film located between the mass-adding film and the surface of the first dielectric film on the opposite side from the piezoelectric substrate, T1/(T1+T2)
Public/Granted literature
- US20190356296A1 ACOUSTIC WAVE DEVICE, RADIO-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE Public/Granted day:2019-11-21
Information query
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