Invention Grant
- Patent Title: Elastic wave device, high-frequency front-end circuit, and communication apparatus
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Application No.: US16177542Application Date: 2018-11-01
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Publication No.: US10797680B2Publication Date: 2020-10-06
- Inventor: Masakazu Mimura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2b56419d
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/17 ; H03H3/10 ; H03H9/02 ; H03H9/145 ; H03H3/02 ; H01Q3/26

Abstract:
An elastic wave device includes a supporting substrate, an acoustic reflection layer disposed on the supporting substrate, a piezoelectric layer disposed on the acoustic reflection layer, and an interdigital transducer electrode disposed on the piezoelectric layer. The acoustic reflection layer includes three or more low acoustic impedance layers and two or more high acoustic impedance layers. A film thickness of the low acoustic impedance layer closest to the piezoelectric layer is larger than a film thickness of the low acoustic impedance layer closest to the low acoustic impedance layer that is closest to the piezoelectric layer.
Public/Granted literature
- US20190165763A1 ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION APPARATUS Public/Granted day:2019-05-30
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