Invention Grant
- Patent Title: Insertion device
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Application No.: US16482331Application Date: 2018-01-31
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Publication No.: US10798811B2Publication Date: 2020-10-06
- Inventor: Hideo Kitamura , Shinsaku Mizumoto
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@66273bbe
- International Application: PCT/JP2018/003157 WO 20180131
- International Announcement: WO2018/143253 WO 20180809
- Main IPC: H05H7/04
- IPC: H05H7/04 ; H05H7/08 ; H05H13/04

Abstract:
A device includes: a first magnet array; a first magnet support body; a second magnet array; a second magnet support body; a gap drive mechanism for performing vertical drive of the magnet support bodies to change a gap; first, second connection beams connected to the magnet support bodies; a mechanism for connecting the connection beams to the gap drive mechanism; a cancellation spring mechanism for cancelling a suction force that acts between magnet arrays; and a spring interlocking mechanism for connecting the cancellation spring mechanism to the magnet support bodies. In the spring interlocking mechanism, first and second spring support frames that are connected to the first and second connection beams via a connecting portion, and a guide mechanism for guiding vertical movements of the first and second spring support frames are mounted, and the cancellation spring mechanism are mounted to both the first and second spring support frames.
Public/Granted literature
- US20200053863A1 INSERTION DEVICE Public/Granted day:2020-02-13
Information query
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