Invention Grant
- Patent Title: Flexible printed circuit to mitigate cracking at through-holes
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Application No.: US16346444Application Date: 2017-10-30
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Publication No.: US10798819B2Publication Date: 2020-10-06
- Inventor: Brian J. Fitzpatrick , Jeffrey Cook , Jitendra Hansalia , Amid Ihsan Hashim
- Applicant: COMMSCOPE, INC. OF NORTH CAROLINA
- Applicant Address: US NC Hickory
- Assignee: COMMSCOPE, INC. OF NORTH CAROLINA
- Current Assignee: COMMSCOPE, INC. OF NORTH CAROLINA
- Current Assignee Address: US NC Hickory
- Agency: Merchant & Gould P.C.
- International Application: PCT/US2017/059043 WO 20171030
- International Announcement: WO2018/081710 WO 20180503
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K3/38 ; H05K3/42 ; H05K3/46 ; H05K1/18 ; H05K1/03

Abstract:
Flexible fingers for flexible printed circuits improve the crack resistance of prior art designs. The crack resistance can be improved by encapsulating the trace inside additional layers such that the outer two layers include only the lands of the through-hole, and all other copper is etched away. The crack resistance can also be improved with strategically adding copper on layers other than the trace layer including attaching is to the land of the through-hole as a stub. These two designs can be combined to include a stub trace into a four-layered design.
Public/Granted literature
- US20190297728A1 FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES Public/Granted day:2019-09-26
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