Invention Grant
- Patent Title: Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module
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Application No.: US16306708Application Date: 2017-06-23
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Publication No.: US10798824B2Publication Date: 2020-10-06
- Inventor: Nobuyuki Terasaki , Toyo Ohashi
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@c27a1d4 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@784d1f3
- International Application: PCT/JP2017/023272 WO 20170623
- International Announcement: WO2017/222061 WO 20171228
- Main IPC: H05K3/06
- IPC: H05K3/06 ; H05K3/00 ; H01L35/08 ; H01L23/498 ; H01L23/373 ; H01L23/12 ; H05K1/03 ; H05K1/18 ; H01L23/00
Abstract:
The method for manufacturing an insulated circuit board of the present invention includes: a ceramic/aluminum-joining step of joining an aluminum material to a ceramic substrate and thereby, forming an aluminum layer; a titanium material-disposing step of disposing a titanium material on a surface of the aluminum layer or the aluminum material in a circuit pattern shape; a titanium layer-forming step of performing a heat treatment in a state where the titanium material is laminated on the surface of the aluminum layer or the aluminum material and thereby, forming the titanium layer; and an etching treatment step of etching the aluminum layer on which the titanium layer is formed, into the circuit pattern shape.
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