Invention Grant
- Patent Title: Printed circuit board
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Application No.: US16562480Application Date: 2019-09-06
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Publication No.: US10798825B2Publication Date: 2020-10-06
- Inventor: Hye-Jin Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@53d33423
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K3/42

Abstract:
A printed circuit board includes an insulating material and a circuit, formed on a surface of the insulating material. The circuit comprises a seed layer formed on the surface of the insulating material, an anti-reflection layer formed on the seed layer, and an electroplating layer formed on the anti-reflection layer.
Public/Granted literature
- US20200154574A1 PRINTED CIRCUIT BOARD Public/Granted day:2020-05-14
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