- Patent Title: Polyimide laminate film, method for manufacturing polyimide laminate film, method for manufacturing thermoplastic polyimide, and method for manufacturing flexible metal-clad laminate
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Application No.: US15562619Application Date: 2016-03-30
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Publication No.: US10798826B2Publication Date: 2020-10-06
- Inventor: Seiji Hosogai , Hiroyuki Ushiro , Junpei Saito , Kazuhiro Ono
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e15a0e5
- International Application: PCT/JP2016/060439 WO 20160330
- International Announcement: WO2016/159106 WO 20161006
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B27/28 ; H05K3/02 ; B29C65/02 ; B29C65/00 ; B32B15/20 ; B32B27/08 ; B32B37/18 ; H05K1/03 ; B29K679/00 ; B29L31/34 ; H05K1/02 ; H05K3/46
Abstract:
A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.
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