Invention Grant
- Patent Title: Resin molded product, electronic device, mold, method for manufacturing mold and method for manufacturing resin molded product
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Application No.: US15683536Application Date: 2017-08-22
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Publication No.: US10798838B2Publication Date: 2020-10-06
- Inventor: Kei Oikawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@573fc8da
- Main IPC: H05K5/02
- IPC: H05K5/02 ; B29C33/38 ; G03B17/02 ; B29C45/37 ; B29L31/34

Abstract:
There is provided a resin molded product including a hairline pattern having small roughness and high gloss. The resin molded product includes a surface having a hairline pattern in which a plurality of ridges extending in an X direction is arranged in a Y direction, thus the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, with the hairline pattern having a maximum height Ry of 6 [μm] or less in the X direction, and an arithmetic average curvature Spc of apex points of 625 [1/mm] or less.
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