Invention Grant
- Patent Title: Tinned copper terminal material, terminal, and electrical wire end part structure
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Application No.: US16098996Application Date: 2017-05-09
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Publication No.: US10801115B2Publication Date: 2020-10-13
- Inventor: Kenji Kubota , Yoshie Tarutani , Kiyotaka Nakaya
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@112f2f2c
- International Application: PCT/JP2017/017515 WO 20170509
- International Announcement: WO2017/195768 WO 20171116
- Main IPC: C23F15/00
- IPC: C23F15/00 ; C25D5/12 ; C25D7/06 ; C22C13/00 ; H01R13/03 ; H01B7/00 ; H01B1/02 ; H01R4/18 ; H01R4/62 ; C25D7/00

Abstract:
A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layer 4 formed from zinc or zinc alloy and a tin layer 5 formed from tin or tin alloy are layered in this order on a base material 2 formed from copper or copper alloy; the intermediate zinc layer 4 has a thickness of 0.1 μm to 5.0 μm inclusive and a zinc concentration equal to or more than 5 mass %; and the tin layer 5 has a zinc concentration of 0.4 mass % to 15 mass % inclusive and a grain size of the tin layer 5 is 0.1 μm to 3.0 μm inclusive preferably.
Public/Granted literature
- US20190161866A1 TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END PART STRUCTURE Public/Granted day:2019-05-30
Information query
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