Invention Grant
- Patent Title: Chip electronic component and manufacturing method thereof
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Application No.: US15881296Application Date: 2018-01-26
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Publication No.: US10801121B2Publication Date: 2020-10-13
- Inventor: Hye Yeon Cha , Dong Hwan Lee , Jung Hyuk Jung , Chan Yoon , Hye Min Bang , Tae Young Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27327fc4
- Main IPC: H01F27/28
- IPC: H01F27/28 ; C25D7/00 ; C25D5/02 ; C25D5/10 ; C25D5/16 ; H01F17/00 ; H01F17/04 ; H01F27/29 ; H01F41/04
Abstract:
There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
Public/Granted literature
- US20180148854A1 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-05-31
Information query
