A universal test socket including a first sub-layer including a plurality of first through conductors, the plurality of first through conductors arranged at a first pitch in a first substrate, and a second sub-layer including a plurality of second through conductors, the second sub-layer stacked on the first sub-layer so that the plurality of first through conductors are in contact with the plurality of second through conductors, the plurality of second through conductors arranged at a second pitch in a second substrate, the second pitch being less than or equal to the first pitch may be provided.