Invention Grant
- Patent Title: Bond-pad sharing for head-level thermocouple
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Application No.: US16234831Application Date: 2018-12-28
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Publication No.: US10803886B1Publication Date: 2020-10-13
- Inventor: Declan Macken , Michael Thomas Johnson , Todd Michael Lammers , Kent Edward Bodurtha
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Kagan Binder, PLLC
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G11B5/012 ; G11B5/31 ; G11B5/00 ; G11B5/60

Abstract:
An apparatus includes a slider configured for heat-assisted magnetic recording, the slider comprising an air bearing surface (ABS), a writer, a reader, and a plurality of electrical bond-pads. The apparatus also includes a first component situated at the ABS of the slider proximate the reader and operatively coupled to a first pair of the plurality of electrical bond-pads, the first component being a thermocouple configured to sense for a thermal aspect of a magnetic recording medium surface. According to aspects of the invention, the slider is configured to share at least one bond-pad by operatively coupling a second pair of the plurality of electrical bond-pads to a second component, and the slider is configured to selectively utilize the thermocouple and the second component.
Information query
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