Invention Grant
- Patent Title: Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
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Application No.: US14327462Application Date: 2014-07-09
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Publication No.: US10804083B2Publication Date: 2020-10-13
- Inventor: Yi-Chieh Wang , Cheng-Kuo Wang , Chung-Han Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34 ; C23C14/54 ; C23C14/52

Abstract:
A cathode assembly for a physical vapor deposition (PVD) system includes a target holder and a thickness detector. The target holder is for holding a target, in which the target has a first major surface and a second major surface. The first major surface and the second major surface are respectively proximal and distal to the target holder. The thickness detector is disposed on the target holder. At least one portion of the first major surface is exposed to the thickness detector for allowing the thickness detector to detect the thickness of the target through the first major surface.
Public/Granted literature
- US20160013032A1 CATHODE ASSEMBLY, PHYSICAL VAPOR DEPOSITION SYSTEM, AND METHOD FOR PHYSICAL VAPOR DEPOSITION Public/Granted day:2016-01-14
Information query
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