Invention Grant
- Patent Title: Fin structures with bottom dielectric isolation
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Application No.: US16247545Application Date: 2019-01-14
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Publication No.: US10804136B2Publication Date: 2020-10-13
- Inventor: Kangguo Cheng , Chun-Chen Yeh , Tenko Yamashita , Ruilong Xie
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent Douglas Pearson
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L21/84 ; H01L21/306

Abstract:
Semiconductor fins of a monolithic semiconductor structure are electrically isolated using a dielectric material at the bottoms of the fins. Relatively tall semiconductor fins can be fabricated at a relatively narrow fin pitch while avoiding mechanical instability. The semiconductor fins are grown on sidewalls of semiconductor mandrels and over a dielectric layer. The semiconductor fins are supported during mandrel removal to provide mechanical stability. The semiconductor fins can be employed as channel regions of FinFET devices.
Public/Granted literature
- US20200227306A1 FIN STRUCTURES WITH BOTTOM DIELECTRIC ISOLATION Public/Granted day:2020-07-16
Information query
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