Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16446790Application Date: 2019-06-20
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Publication No.: US10804219B2Publication Date: 2020-10-13
- Inventor: Wan Gi Sohn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f146c90
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/108 ; H01L49/02 ; H01L23/64 ; H01L21/311 ; H01L21/3213 ; H01L23/522

Abstract:
A semiconductor device includes a plurality of lower electrodes repeatedly arranged at a first pitch in a first direction and a second direction crossing the first direction at an acute angle on a substrate, and a support pattern in contact with sidewalls of the plurality of lower electrodes and supporting the plurality of lower electrodes. The support pattern includes a first support region having a plurality of openings penetrating the support pattern and a second support region disposed at a periphery of the first support region. The plurality of openings may continuously extend in a zigzag manner, respectively, throughout an entirety of the first support region.
Public/Granted literature
- US20200152584A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-05-14
Information query
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