Invention Grant
- Patent Title: Non-porous copper to copper interconnect
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Application No.: US16695121Application Date: 2019-11-25
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Publication No.: US10804241B2Publication Date: 2020-10-13
- Inventor: Charles L. Arvin , Christopher D. Muzzy
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor structure which includes a first semiconductor substrate having a first plurality of copper connectors; a second semiconductor substrate having a second plurality of copper connectors; and a joining structure joining the first plurality of copper connectors to the second plurality of copper connectors, the joining structure including a copper intermetallic mesh having pores filled with silver.
Public/Granted literature
- US20200098723A1 NON-POROUS COPPER TO COPPER INTERCONNECT Public/Granted day:2020-03-26
Information query
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