Invention Grant
- Patent Title: Integrated circuit device
-
Application No.: US16170774Application Date: 2018-10-25
-
Publication No.: US10804264B2Publication Date: 2020-10-13
- Inventor: Jae-yup Chung , Il-ryong Kim , Ju-youn Kim , Jin-wook Kim , Kyoung-hwan Yeo , Yong-gi Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ede1783
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/02 ; H01L29/66 ; H01L21/02 ; H01L29/165 ; H01L21/8234 ; H01L21/8238 ; H01L27/092 ; H01L21/762 ; H01L29/08 ; H01L29/06 ; H03K19/0948 ; H01L21/3105 ; H01L21/311 ; H01L21/3213

Abstract:
An integrated circuit device includes a substrate from which a plurality of fin-type active regions protrude, the plurality of fin-type active regions extending in parallel to one another in a first direction, and a plurality of gate structures and a plurality of fin-isolation insulating portions extending on the substrate in a second direction crossing the first direction and at a constant pitch in the first direction, wherein a pair of fin-isolation insulating portions from among the plurality of fin-isolation insulating portions are between a pair of gate structures from among the plurality of gate structures, and the plurality of fin-type active regions include a plurality of first fin-type regions and a plurality of second fin-type regions.
Public/Granted literature
- US20190319027A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2019-10-17
Information query
IPC分类: