Invention Grant
- Patent Title: Electronic equipment assembly apparatus and electronic equipment assembly method
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Application No.: US15785573Application Date: 2017-10-17
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Publication No.: US10804670B2Publication Date: 2020-10-13
- Inventor: Ken Takano , Yuji Takahashi , Kazu Wagatsuma
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@11e1cd67 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1c4fa039
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K13/00 ; H01R43/26 ; B25J9/16 ; H01R12/71 ; H01R13/631 ; H01R43/20
Abstract:
There is provided an electronic equipment assembly apparatus including: a cable mounting mechanism which holds a cable and installs the cable onto a connector; a lock operation mechanism which operates a lock mechanism provided in the connector; a locked-state checker which checks a state of the lock mechanism of the connector; and a controller which controls the cable mounting mechanism and the lock operation mechanism.
Public/Granted literature
- US20180123306A1 ELECTRONIC EQUIPMENT ASSEMBLY APPARATUS AND ELECTRONIC EQUIPMENT ASSEMBLY METHOD Public/Granted day:2018-05-03
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