Invention Grant
- Patent Title: Organic insulating body, metal-clad laminate and wiring board
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Application No.: US16319183Application Date: 2017-07-19
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Publication No.: US10806031B2Publication Date: 2020-10-13
- Inventor: Tadashi Nagasawa , Chie Chikara , Satoshi Kajita
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@37f69370 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3c134a48 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@9ca421a
- International Application: PCT/JP2017/026109 WO 20170719
- International Announcement: WO2018/016527 WO 20180125
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B15/085 ; C08K5/14 ; H05K1/09
Abstract:
There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120° C. or higher in a dynamic mechanical analysis.
Public/Granted literature
- US20200077514A1 ORGANIC INSULATING BODY, METAL-CLAD LAMINATE AND WIRING BOARD Public/Granted day:2020-03-05
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