A thermoelectric assembly includes a thermoelectric module having a hot side and a cold side, where a heat sink is coupled with the hot side of the thermoelectric module and a cold sink is coupled with the cold side of the thermoelectric module. A gasket is disposed between the heat sink and the cold sink and extends around a portion of the thermoelectric module. A vapor barrier is attached to and covers an outer surface of the gasket to prevent water vapor from penetrating the outer surface of the gasket.