A sensing module according to an embodiment includes: a substrate; a sensing electrode formed on a first surface of the substrate; a reaction layer formed on the first surface of the substrate and burying an upper surface of the substrate and the sensing electrode; a driving unit electrically connected to the sensing electrode formed on the first surface of the substrate and processing a sensing signal transmitted through the sensing electrode; and a protective layer formed surrounding the driving unit, wherein an impedance value of the reaction layer is changed by an external contact material, and the sensing electrode transmits the sensing signal with respect to the impedance value of the reaction layer to the driving unit.