- Patent Title: Substrate transfer apparatus and substrate processing system comprising plural connection units arranged side by side in a vertical and lateral directions along one side surface of a transfer chamber
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Application No.: US16272150Application Date: 2019-02-11
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Publication No.: US10811289B2Publication Date: 2020-10-20
- Inventor: Norihiko Tsuji
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@57cc07d
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/673
Abstract:
There is provided a substrate transfer apparatus for unloading each of a plurality of target substrates, which is to be transferred to each of a plurality of processing devices, from each of a plurality of containers connected to the substrate transfer apparatus, each of the plurality of containers being configured to accommodate the plurality of target substrates. The apparatus comprises: a transfer chamber including an arm disposed to take out each of the plurality of target substrates which is to be transferred to each of the plurality of processing devices from each of the plurality of containers; a plurality of connection units arranged side by side in a vertical direction and a lateral direction along one side surface of the transfer chamber, and connected to the plurality of containers, respectively; and movement mechanisms configured to move at least one of the plurality of connection units in the lateral direction.
Public/Granted literature
- US20190252225A1 Substrate Transfer Apparatus and Substrate Processing System Public/Granted day:2019-08-15
Information query
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