Invention Grant
- Patent Title: Integrated assemblies comprising redundant wiring routes, and integrated circuit decks having openings extending therethrough
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Application No.: US16821841Application Date: 2020-03-17
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Publication No.: US10811340B2Publication Date: 2020-10-20
- Inventor: Werner Juengling
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/528 ; G11C11/408 ; H01L27/108 ; H01L25/065 ; H01L25/18 ; H01L23/532

Abstract:
Some embodiments include an integrated assembly having a conductive line supported by a deck and extending along a longitudinal direction. The conductive line is configured to carry an electrical signal. A connection region is along the conductive line. The conductive line splits amongst multiple components as it passes through the connection region. The components are spread-apart from one another along a lateral direction which is orthogonal to the longitudinal direction. An opening extends vertically through the deck and through the connection region. The opening breaks one of the components of the conductive line to leave another of the components to carry the electrical signal across the connection region.
Public/Granted literature
Information query
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