Invention Grant
- Patent Title: High voltage device and manufacturing method thereof
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Application No.: US16352795Application Date: 2019-03-13
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Publication No.: US10811532B2Publication Date: 2020-10-20
- Inventor: Tsung-Yi Huang , Chien-Yu Chen
- Applicant: RICHTEK TECHNOLOGY CORPORATION
- Applicant Address: TW Zhubei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei, Hsinchu
- Agency: Tung & Associates
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@25573cc1
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L21/762 ; H01L29/06 ; H01L29/66

Abstract:
A high voltage device includes: a semiconductor layer, an isolation structure, a drift oxide region, a well, a body region, a body contact, a buffer region, a gate, and a source and a drain. The body contact includes a main body contact and at least one sub-body contact. The main body contact is adjacent to the source, wherein the main body contact and the source are rectangles that extend along a width direction, and the source is located between the main body contact and the gate. The sub-body contact extends from the main body contact toward the gate and contacts an inverse current channel. The buffer region encompasses all the periphery of the body region below a top surface of the semiconductor layer, wherein an impurity concentration of the buffer region is lower than an impurity concentration of the body region.
Public/Granted literature
- US20190378924A1 HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-12-12
Information query
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