Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.