Invention Grant
- Patent Title: Wireless damage assessment during manufacturing
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Application No.: US15670372Application Date: 2017-08-07
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Publication No.: US10816513B2Publication Date: 2020-10-27
- Inventor: Paul Henry Ziehl
- Applicant: University of South Carolina
- Applicant Address: US SC Columbia
- Assignee: University of South Carolina
- Current Assignee: University of South Carolina
- Current Assignee Address: US SC Columbia
- Agency: Dority & Manning, P.A.
- Main IPC: G01N29/44
- IPC: G01N29/44 ; G01M99/00 ; G01N29/04 ; G01N29/14 ; G01N29/24 ; H04W84/18

Abstract:
A non-intrusive monitoring method and system for the detection and potential assessment of damage that may occur during a manufacturing process is described. Potential damage events such as impact events can be detected by one or more sensors located on a workpiece or on a machine utilized in the manufacturing process. Through wireless monitoring of the sensors, potential damage events are detected and products of the manufacturing process can be examined to determine if the event has led to damage.
Public/Granted literature
- US20180045688A1 Wireless Damage Assessment During Manufacturing Public/Granted day:2018-02-15
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