Invention Grant
- Patent Title: Method and apparatus for plasma dicing a semi-conductor wafer
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Application No.: US16279560Application Date: 2019-02-19
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Publication No.: US10818552B2Publication Date: 2020-10-27
- Inventor: Tsu-Wu Chiang , Russell Westerman
- Applicant: Plasma-Therm LLC
- Applicant Address: US FL St. Petersburg
- Assignee: Plasma-Therm LLC
- Current Assignee: Plasma-Therm LLC
- Current Assignee Address: US FL St. Petersburg
- Agency: Burr & Forman LLP
- Agent Harvey S. Kauget
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01J37/32 ; H01L21/3065 ; H01L21/683 ; H01L23/31
Abstract:
The present invention provides a method for plasma dicing a substrate. The substrate is provided with a top surface and a bottom surface, the top surface of the substrate having a plurality of street areas and at least one device structure. The substrate is placed onto a support film on a frame to form a work piece. A process chamber having a plasma source is provided. A work piece support is provided within the plasma process chamber. The work piece is placed onto the work piece support. A plasma is generated from the plasma source in the plasma process chamber. The work piece is processed using the generated plasma and a byproduct generated from the support film while the support film is exposed to the generated plasma.
Public/Granted literature
- US20190189513A1 METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER Public/Granted day:2019-06-20
Information query
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