Invention Grant
- Patent Title: Datacenter 3D solid state drives with matrix cooling
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Application No.: US15906925Application Date: 2018-02-27
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Publication No.: US10818575B2Publication Date: 2020-10-27
- Inventor: Chin-Tien Chiu , Zhongli Ji , Hem Takiar
- Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4ea214ed
- Main IPC: H01L23/46
- IPC: H01L23/46 ; H01L25/065 ; H01L23/467 ; H01L23/367
Abstract:
A solid state drive is disclosed including a planar array of semiconductor devices for use in a datacenter, and a system for cooling the planar array of semiconductor devices. The semiconductor devices may be arranged in a grid pattern, spaced apart from each other so as to define rows and columns of flow pathways, or cooling tunnels, around and between the semiconductor devices.
Public/Granted literature
- US20190189536A1 DATACENTER 3D SOLID STATE DRIVES WITH MATRIX COOLING Public/Granted day:2019-06-20
Information query
IPC分类:
