Invention Grant
- Patent Title: Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
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Application No.: US16680649Application Date: 2019-11-12
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Publication No.: US10818582B2Publication Date: 2020-10-27
- Inventor: Aira Lourdes Villamor , Erwin Victor Cruz , Geraldine Suico , Silnore Sabando
- Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
- Applicant Address: US AZ Phoenix
- Assignee: FAIRCHILD SEMICONDUCTOR CORPORATION
- Current Assignee: FAIRCHILD SEMICONDUCTOR CORPORATION
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/495 ; H01L23/492 ; H01L21/56 ; H01L21/48 ; H01L23/31
Abstract:
In a general aspect, a method for producing a packaged semiconductor device can include coupling a semiconductor device to a leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The method can also include forming, with a laser, a groove in the signal lead, the groove having a first sidewall and a second sidewall, and applying solder plating to the signal lead, including the first sidewall and the second sidewall of the groove. The method can further include separating, at the groove, the signal lead into a first portion and a second portion, such that the second portion of the signal lead is separated from the metal leadframe structure.
Public/Granted literature
- US20200083148A1 PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AND METHODS OF MANUFACTURE Public/Granted day:2020-03-12
Information query
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