A semiconductor structure includes a die, a molding surrounding the die, a first seal ring disposed over the molding, and a second seal ring disposed below the molding. The semiconductor structure further includes a first interconnect structure disposed below the first surface of the die and a second interconnect structure disposed over the second surface and the molding. The first seal ring is disposed in the second interconnect structure and disposed over the molding, and the second seal ring is provided within the die and the first interconnect structure.