Invention Grant
- Patent Title: Nitride semiconductor substrate, semiconductor device, and method for manufacturing nitride semiconductor substrate
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Application No.: US16088221Application Date: 2017-02-10
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Publication No.: US10818757B2Publication Date: 2020-10-27
- Inventor: Yoshinobu Narita
- Applicant: SCIOCS COMPANY LIMITED , SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Ibaraki JP Tokyo
- Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Ibaraki JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68e72e2a
- International Application: PCT/JP2017/004983 WO 20170210
- International Announcement: WO2017/169176 WO 20171005
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/02 ; H01L29/20 ; H01L29/861 ; H01L29/872

Abstract:
There is provided a nitride semiconductor substrate, including: a substrate configured as an n-type semiconductor substrate; and a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons, wherein a concentration of the donors in the drift layer is 5.0×1016/cm3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer, and a difference obtained by subtracting the concentration of the carbons that function as acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually decreased from a substrate side toward a surface side of the drift layer.
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