An electric connection assembly for surface mounting on a circuit board comprises a soldering pin. The soldering pin has a starting portion disposed in a housing of the electric connection assembly, a middle portion, and an end portion disposed at an end of the soldering pin opposite the starting portion and contacting the circuit board. The middle portion is bent from the starting portion in a direction toward the housing and the end portion is bent from the middle portion in a direction away from the housing. An acute angle is formed between both the starting portion and the middle portion and between the middle portion and the end portion.