Invention Grant
- Patent Title: Transfer molded fluid flow structure
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Application No.: US14770402Application Date: 2013-07-29
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Publication No.: US10821729B2Publication Date: 2020-11-03
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@45288df2 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@597eacc7 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b422842 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@690391f1 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6845d63e
- International Application: PCT/US2013/052505 WO 20130729
- International Announcement: WO2014/133577 WO 20140904
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.
Public/Granted literature
- US20160009085A1 TRANSFER MOLDED FLUID FLOW STRUCTURE Public/Granted day:2016-01-14
Information query
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