Invention Grant
- Patent Title: Electrically-conductive curable organosilicon rubber
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Application No.: US16067447Application Date: 2016-12-29
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Publication No.: US10822473B2Publication Date: 2020-11-03
- Inventor: Liya Jia , Yuanzhi Yue
- Applicant: ELKEM SILICONES SHANGHAI CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: ELKEM SILICONES SHANGHAI CO., LTD.
- Current Assignee: ELKEM SILICONES SHANGHAI CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: McBee Moore & Vanik IP, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f0c214a
- International Application: PCT/CN2016/112828 WO 20161229
- International Announcement: WO2017/114440 WO 20170706
- Main IPC: C08K7/06
- IPC: C08K7/06 ; C08K3/04 ; C08L83/04 ; C08J5/00 ; H01B1/24 ; C08G77/20 ; C08G77/12

Abstract:
The present invention relates to a carbon fiber-containing curable organosilicon composition and a method for preparing the carbon fiber-containing organosilicon composition. The present invention also relates to the electrically conductive rubber obtained by curing the carbon fiber-containing organosilicon composition and its uses. The curable organosilicon composition comprises: (A) a polysiloxane base composition, and (B) a carbon fiber component; wherein, the carbon fiber component comprises, based on the weight of (A) polysiloxane base composition, 2 to 300%, preferably 5 to 250%, more preferably 15 to 150% of a carbon fiber with average length of 10 μm to 5000 μm, preferably 30-3500 μm, more preferably 60-3000 μm with the provisos that: (1) if the carbon fiber component comprises exclusively carbon fiber with average length of not greater than 200 μm, its content is greater than 25%; and (2) if the carbon fiber component comprises exclusively carbon fiber with average length of greater than 2800 μm, its content is not greater than 40%.
Public/Granted literature
- US20190023874A1 ELECTRICALLY-CONDUCTIVE CURABLE ORGANOSILICON RUBBER Public/Granted day:2019-01-24
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