Invention Grant
- Patent Title: Composite resin composition
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Application No.: US15817879Application Date: 2017-11-20
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Publication No.: US10822482B2Publication Date: 2020-11-03
- Inventor: Masashi Hamabe , Toshifumi Nagino
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74d4f5fd
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08J5/04

Abstract:
Provided is a composite resin composition to be used as a material for a molded article produced by a molding machine. The composite resin composition includes a main ingredient resin 1 and a fibrous filler 2, and the fiber length direction end of the fibrous filler 2 is defibrated. The length of the defibrated portion 3 is 5% or more and 50% or less of the fiber length of the entire fibrous filler 2. The fiber diameter in the defibrated portion 3 of the fibrous filler 2 is 1/1000 or more and 1/10 or less the fiber diameter in the undefibrated portion. The modulus of elasticity of the fibrous filler 2 is higher than the modulus of elasticity of the main ingredient resin 1, and the difference between these moduli of elasticity is within 20 GPa.
Public/Granted literature
- US20180201770A1 COMPOSITE RESIN COMPOSITION Public/Granted day:2018-07-19
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