Invention Grant
- Patent Title: Polishing composition and method for polishing magnetic disk substrate
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Application No.: US15935925Application Date: 2018-03-26
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Publication No.: US10822525B2Publication Date: 2020-11-03
- Inventor: Toru Iwata , Akira Sugawa
- Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
- Applicant Address: JP
- Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
- Current Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
- Current Assignee Address: JP
- Agency: Bracewell LLP
- Agent Brad Y. Chin
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3a50cdf1
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; B24B37/00 ; C09G1/16 ; G11B5/84 ; B24B37/04
Abstract:
Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.
Public/Granted literature
- US20180215953A1 POLISHING COMPOSITION AND METHOD FOR POLISHING MAGNETIC DISK SUBSTRATE Public/Granted day:2018-08-02
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