Invention Grant
- Patent Title: Method of manufacturing diamond substrate, diamond substrate, and diamond composite substrate
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Application No.: US16654085Application Date: 2019-10-16
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Publication No.: US10822693B2Publication Date: 2020-11-03
- Inventor: Takuji Okahisa , Yoshiyuki Yamamoto , Yoshiki Nishibayashi , Natsuo Tatsumi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6f1e7d7
- Main IPC: C23C16/01
- IPC: C23C16/01 ; C23C16/27 ; C30B29/04 ; C23C16/56 ; C23C16/02 ; C01B32/25 ; H01L21/762 ; C30B33/06 ; C01B32/26 ; C23C14/48 ; C30B25/20 ; C30B33/02 ; C30B33/10

Abstract:
A method of manufacturing a diamond substrate includes: forming an ion implantation layer at a side of a main surface of a diamond seed substrate by implanting ions into the main surface of the diamond seed substrate; producing a diamond structure by growing a diamond growth layer by a vapor phase synthesis method on the main surface of the diamond seed substrate, after implanting the ions; and performing heat treatment on the diamond structure. The performed heat treatment causes the diamond structure to be separated along the ion implantation layer into a first structure including the diamond seed substrate and failing to include the diamond growth layer, and a diamond substrate including the diamond growth layer. Thus, the method of manufacturing a diamond substrate is provided that enables a diamond substrate with a large area to be manufactured in a short time and at a low cost.
Public/Granted literature
- US20200040446A1 METHOD OF MANUFACTURING DIAMOND SUBSTRATE, DIAMOND SUBSTRATE, AND DIAMOND COMPOSITE SUBSTRATE Public/Granted day:2020-02-06
Information query
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