Invention Grant
- Patent Title: Thermal barrier system with bond coat barrier
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Application No.: US15149348Application Date: 2016-05-09
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Publication No.: US10822966B2Publication Date: 2020-11-03
- Inventor: Julie Marie Chapman , Robert Eckert , Nripendra Nath Das
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: C23C30/00
- IPC: C23C30/00 ; F01D5/28 ; C23C28/00 ; C23C28/04

Abstract:
A coating system disposed on a surface of a substrate is provided. The coating system includes a bond coating on the surface of the substrate, a protective coating on the bond coating, a thermal barrier coating on the protective coating, and a protective agent disposed within at least some of the voids of the thermal barrier coating. The protective coating is constructed from a ceramic material, and the thermal barrier coating defines a plurality of elongated surface-connected voids. Methods are also generally provided for forming such a coating system.
Public/Granted literature
- US20170321559A1 THERMAL BARRIER SYSTEM WITH BOND COAT BARRIER Public/Granted day:2017-11-09
Information query
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