A system for scanning and analyzing a device wider test includes a transducer. The transducer transmits ultrasonic waves to scan the device under test and determine various properties (e.g., material of layers). The system further includes a heating/cooling portion. The heating/cooling portion conducts thermal stress testing on the device under test to accentuate areas of delamination between layers. The transducer then performs scans on the device under test to locate areas of delamination.