Invention Grant
- Patent Title: Sensor assembly
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Application No.: US15818656Application Date: 2017-11-20
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Publication No.: US10823824B2Publication Date: 2020-11-03
- Inventor: David J. Schmidt
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Bejin Bieneman PLC
- Agent Frank A. MacKenzie
- Main IPC: G01S7/481
- IPC: G01S7/481 ; G01S17/08 ; G01S17/42 ; G01S17/10 ; B60H1/00

Abstract:
A sensor assembly includes a sensor window, a heatsink including a plurality of fins, and a duct. The heatsink is fixed relative to the sensor window. The duct is positioned to direct airflow between the fins and across the sensor window. The sensor assembly may include a motor and/or a circuit board fixed relative to the sensor window. The heatsink may be directly connected by a thermal conductor to the motor and/or the circuit board.
Public/Granted literature
- US20190154800A1 SENSOR ASSEMBLY Public/Granted day:2019-05-23
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