Invention Grant
- Patent Title: Electronic device
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Application No.: US16445250Application Date: 2019-06-19
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Publication No.: US10824205B2Publication Date: 2020-11-03
- Inventor: Che-Hsien Lin
- Applicant: Che-Hsien Lin
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20 ; H05K5/02

Abstract:
An electronic device includes a first body, a second body, a hinge module and a linkage mechanism. The second body includes a main body portion and a back cover movably disposed to the main body portion. The hinge module is pivoted between the first body and the second body. The linkage mechanism is disposed in the second body, and is connected to the hinge module. The back cover is fixed to the linkage mechanism. The linkage mechanism is changed between a first state and a second state. When the linkage mechanism is in the first state, there is a first space between the back cover and the hinge module. When the linkage mechanism is in the second state, there is a second space between the back cover and the hinge module. The second space is larger than the first space.
Public/Granted literature
- US20190391619A1 ELECTRONIC DEVICE Public/Granted day:2019-12-26
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