Invention Grant
- Patent Title: Chip attached to a die pad having a concave structure
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Application No.: US16291450Application Date: 2019-03-04
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Publication No.: US10825756B2Publication Date: 2020-11-03
- Inventor: Hideharu Kojima , Yoshiharu Takada
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Minato-ku JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Minato-ku JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4bc79457
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L21/00 ; H05K7/12 ; H01L21/48 ; H01L23/00
Abstract:
According to one embodiment, a semiconductor device includes a semiconductor chip, and a die pad. The die pad has a first surface. The semiconductor chip is bonded on the first surface using a paste including a metal particle. A concave structure is provided in the first surface. The concave structure is positioned directly under each of a plurality of sides of the semiconductor chip and extends along each of the plurality of sides.
Public/Granted literature
- US20200075464A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-03-05
Information query
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