Invention Grant
- Patent Title: Semiconductor device including resistor structure
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Application No.: US16277597Application Date: 2019-02-15
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Publication No.: US10825768B2Publication Date: 2020-11-03
- Inventor: Tae-Hee Lee , Hee-Sung Kam , Kyoung-Hoon Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3e55f57a
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/20 ; H01L23/522 ; H01L21/768 ; H01L49/02

Abstract:
A semiconductor device includes a substrate including a resistor region, a plurality of lower patterns in the resistor region, and a resistor line pattern on the plurality of lower patterns and the substrate of the resistor region. The plurality of lower patterns extend in a first direction parallel to a surface of the substrate and are spaced apart from each other in a second direction perpendicular to the first direction and parallel to the surface of the substrate. The resistor line pattern extends in the second direction. The resistor line pattern on the lower patterns has an upper surface and a lower surface protruding in a third direction perpendicular to the surface of the substrate.
Public/Granted literature
- US20200051912A1 SEMICONDUCTOR DEVICE INCLUDING RESISTOR STRUCTURE Public/Granted day:2020-02-13
Information query
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