Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16424000Application Date: 2019-05-28
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Publication No.: US10825774B2Publication Date: 2020-11-03
- Inventor: Juhyeon Oh , Sunchul Kim , Hyunki Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6988c663 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@26d4c7db
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L23/16 ; H01L25/18 ; H01L21/52
Abstract:
A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.
Public/Granted literature
- US20200043854A1 SEMICONDUCTOR PACKAGE Public/Granted day:2020-02-06
Information query
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