Invention Grant
- Patent Title: Polymer resin and compression mold chip scale package
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Application No.: US16364104Application Date: 2019-03-25
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Publication No.: US10825786B2Publication Date: 2020-11-03
- Inventor: Yusheng Lin , Soon Wei Wang , Chee Hiong Chew , Francis J. Carney
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/78 ; H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L23/544
Abstract:
A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to one or more sides of the wafer; and applying a compression mold on at least part of a second surface of the wafer and to one or more sides of the wafer, said first and second surfaces opposing each other.
Public/Granted literature
- US20190221532A1 POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE Public/Granted day:2019-07-18
Information query
IPC分类:
