Invention Grant
- Patent Title: Method of manufacturing semiconductor devices
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Application No.: US16427162Application Date: 2019-05-30
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Publication No.: US10825795B2Publication Date: 2020-11-03
- Inventor: Yeong-Seok Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68b41f48
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H05K3/32 ; C09J5/06 ; H01L21/50 ; H01L21/603 ; H01L21/60
Abstract:
A method of manufacturing a semiconductor device may include forming an adhesive film on a surface of a semiconductor chip, mounting the semiconductor chip on a substrate such that the adhesive film contacts an upper surface of the substrate, and bonding the semiconductor chip and the substrate curing the adhesive film by simultaneously performing a thermo-compression process and an ultraviolet irradiation process on the adhesive film disposed between the substrate and the semiconductor chip.
Public/Granted literature
- US20200144222A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2020-05-07
Information query
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