Invention Grant
- Patent Title: Semiconductor device and method of manufacturing a semiconductor device
-
Application No.: US16356558Application Date: 2019-03-18
-
Publication No.: US10825922B2Publication Date: 2020-11-03
- Inventor: Jay Paul John , James Kirchgessner
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4689d81a
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L21/02 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor device comprises: an extrinsic base region; a first dielectric spacer on at least a part of a sidewall of the extrinsic base region adjacent to an emitter window region; an intrinsic base region; a base link region coupling the intrinsic base region and the extrinsic base region; a collector region underlying the intrinsic base region and having a periphery underlying the base link region; and a second dielectric spacer, separating the base link region from at least the periphery of the collector region; wherein said second dielectric spacer extends laterally beyond said first dielectric spacer to underlie said emitter window region.
Public/Granted literature
- US20190305119A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2019-10-03
Information query
IPC分类: