Invention Grant
- Patent Title: Gate-all-around structure and manufacturing method for the same
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Application No.: US16005631Application Date: 2018-06-11
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Publication No.: US10825933B2Publication Date: 2020-11-03
- Inventor: Meng-Hsuan Hsiao , Wei-Sheng Yun , Winnie Victoria Wei-Ning Chen , Tung Ying Lee , Ling-Yen Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/423 ; H01L29/16 ; H01L29/66 ; H01L27/092 ; H01L29/06

Abstract:
Present disclosure provides gate-all-around structure including a semiconductor fin having a top surface, a first nanowire over the top surface, a first space between the top surface and the first nanowire, an Nth nanowire and an (N+1)th nanowire over the first nanowire, and a second space between the Nth nanowire and the (N+1)th nanowire. The first space is greater than the second space. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.
Public/Granted literature
- US20190378934A1 GATE-ALL-AROUND STRUCTURE AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2019-12-12
Information query
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