Invention Grant
- Patent Title: Trench MOS-type Schottky diode
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Application No.: US16096717Application Date: 2017-04-20
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Publication No.: US10825935B2Publication Date: 2020-11-03
- Inventor: Kohei Sasaki , Masataka Higashiwaki
- Applicant: TAMURA CORPORATION , National Institute of Information and Communications Technology
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: TAMURA CORPORATION,National Institute of Information and Communications Technology
- Current Assignee: TAMURA CORPORATION,National Institute of Information and Communications Technology
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1b5752f0
- International Application: PCT/JP2017/015825 WO 20170420
- International Announcement: WO2017/188105 WO 20171102
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/47 ; H01L29/868 ; H01L29/861 ; H01L29/24 ; H01L29/36

Abstract:
A trench MOS-type Schottky diode includes a first semiconductor layer including a Ga2O3-based single crystal, a second semiconductor layer that is a layer laminated on the first semiconductor layer and that includes a Ga2O3-based single crystal and a trench opened on a surface thereof opposite to the first semiconductor layer, an anode electrode formed on the surface of the second semiconductor layer opposite to the first semiconductor layer, a cathode electrode formed on a surface of the first semiconductor layer opposite to the second semiconductor layer, an insulating film covering the inner surface of the trench of the second semiconductor layer, and a trench MOS gate that is embedded in the trench of the second semiconductor layer so as to be covered with the insulating film and is in contact with the anode electrode.
Public/Granted literature
- US20190148563A1 TRENCH MOS-TYPE SCHOTTKY DIODE Public/Granted day:2019-05-16
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